| Grade | MFR (g/10min) | Density (g/cm3) | Application |
|---|---|---|---|
| Compound Resin | |||
| C1809PJ-02 | 5 | 1.33 | Electronic & Housing |
| S908C | 2.2 | 1.11 | Electronic & Housing |
| PS | |||
| H241R | 0 | 0 | Electronic & Housing |
| H350 | 3.5 | 1.04 | Electronic & Housing |
| H350E | 2.6 | 1.04 | Electronic & Housing |
| H360 | 5.0 | 1.04 | Electronic & Housing |
| H370 | 5.0 | 1.04 | Electronic & Housing |
| H820E | 2.8 | 1.04 | Electronic & Housing |
| H950 | 3.0 | 1.04 | Electronic & Housing |
| THF77 | 8.4 | 1.05 | Electronic & Housing |
| THH102 | 2.6 | 1.05 | Electronic & Housing |
| THH103 | 1.7 | 1.05 | Electronic & Housing |
| TMF35 | 4.5 | 1.05 | Electronic & Housing |
